Slink® EP-123 單組份低溫快速硬化環氧膠
100 ℃, 5分鐘快速固化 (80 ℃, 20-25分鐘).
高抗張強度/結構性接著披覆.
高硬度.
絕緣/抗電壓. 低固化收縮率.
優越的耐化學品抗蝕能力.
Slink® EP-123 Low temperature cure Epoxy Adhesive
PRODUCT DESCRIPTION
Slink® EP-127 is single component, low temperature thermal curable epoxy adhesive for structural bonding of metals and composite. Product formulate with high tensile shear strength and excellent adhesion on Aluminum, stainless steel, copper, PCB, ceramic and some plastics.
PHYSICAL PROPERTIES
|
Appearance |
Tranparent, Black, White |
|
Chemical base |
Epoxy Resin |
|
Specific Gravity [g/cm³] |
Approx. 1.18 |
|
Flash Point [℃] (TCC) |
> 200 |
|
Viscosity [cps] at 23°C |
5000~8000cp |
|
Solvent |
None |
|
Odor |
Low |
CURE CONDITIONS
|
Temp. |
℃ |
80 |
90 |
100 |
|
time |
min. |
15~25 |
10-15 |
5-8 |
STORAGE
Slink® EP-123 is heat sensitive product, store in 0~
SHELF LIFE
6 months in original package and store in 0~
PACKAGES
30ml dispensing syringe